Manufacturing process of LTPS-TFT-LCD 2024 edition

Explain LTPS (Low temperature poly-Si) TFT-LCD Manufacturing process by illustration
Full-cover from basic process to next generation process

Explain TFT structure, and process flow of TFT array, CF array, LC cell, and module assemble.
Cover process flow of circuit area in addition to that of pixel area
Describe these illustrations at 3D image
Cover TFT structure of LDD, GOLDD, Dual Gate, and CLDD

Easy to look at the file using any PC because of the format of browser, for example IE (Internet Explorer)
Possible to access at will from Index Page to detail page
Number of total file are 56 (about 120 page in A4 form equivalent)
Illustrations of device structure and process flow are approximately 260.

■Structure of LTPS-TFT-LCD
@Single drain structure (SD)
ADual Gate structure
BLDD (Lightly Doped Drain) structure
CGOLDD (Gate Overlapped LDD) structure
DCLDD (Compound LDD) structure

■Crystallization process

■TFT array process
@Single drain structure (SD)
ALDD (Lightly Doped Drain) structure
BGOLDD (Gate Overlapped LDD) structure
  Forming process of poly-Si
  Forming process of TFT area (PEP1)
  Batch forming process of S/D in TFT area and N-channel (PEP1)
  High concentration P doping process (PEP2)
  Forming process of gate electrode and capacitor electrode (PEP3)
  P-TFT High concentration N doping process (PEP4)
  Forming process of contact hole (PEP5)
  Forming process of data line (PEP6)
  Hydrotreatment, form passivation and planarization layer (PEP7)
  Manufacturing process of pixel electrode (PEP8)
  P-TFT ion doping process
  N-TFT ion doping process

■CF (Color filter) forming process
  Manufacturing process of CF for IPS mode/FFS mode TFT-LCD
  Manufacturing process of CF for VA mode TFT-LCD
  Manufacturing process of CF for TN/OCB mode TFT-LCD
   Black matrix forming process
   Manufacturing process of R, G, B color layer
   Manufacturing process of overcoat layer
   Deposition process of opposite electrode
   Manufacturing process of post-spacer
   Manufacturing process of rib (bump)
   Photo-alignment process (for MVA mode TFT-LCD)

■LC cell process
  Polyimid coating process
  Alignment process
  Seal layer forming process
  Dispersion process of spacer-ball
  Making panel thinner process
  Scribe and break process
  Filling process of LC material
  ODF (One drop fill) process

■Module assemble process
  Connect panel and driver-IC

■Liquid crystal material and display mechanism

■Structure of backlight module

■3D technology
Method to use a specific glasses
  LC shutter glasses method (Time sequential method)
  Polarized glasses + patterned phase difference film (Space division method)

Specific glasses-free method
  Parallax barrier method
  Parallax barrier using dual emission OLED
  Time sequential driving + parallax LC barrier method
  Lenticular lens method
  Time sequential twin-lens 3D-OCB method
  Lenticular + time sequential scanning backlight method

Detail of material and system is explained

▲TFT structure

▲Crystallization process

▲Half-tone process

Full-original CD-ROM

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Price:23,000 yen
Release date:January 4th, 2024

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CD-ROM lists of English virsion

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