Manufacturing process of a-Si TFT-LCD 2024 edition

Explain a-Si TFT-LCD Manufacturing process by illustration
Full-cover from basic process to next generation process

Explain TFT structure, and process flow of TFT array, CF array, LC cell, and module assemble.
Cover 3D technology of with and without glasses method

Easy to look at the file using any PC because of the format of browser, for example IE (Internet Explorer)
Possible to access at will from Index Page to detail page
Describe these illustrations at 3D image

Number of total file are 63 (about 150 page in A4 form equivalent)
Illustrations of device structure and process flow are approximately 270.


Structure of a-Si TFT-LCD

Liquid crystal material and display mechanism

TFT array process
Etch-stopped layer type
Back-channel-etched type (5 masks)
Back-channel-etched type (4 masks)
@ Forming process of gate electrode
@ Forming process of gate insulator film, a-Si film, and etching stopper film (Etch-stopped layer type)
@ Forming process of a-Si island, S/D electrode(Etch-stopped layer type)
@ Forming process of data line and S/D electrode
@ Forming process of passivation layer and contact hole
@ Forming process of pixel electrode
@ Forming process of gate insulator film, a-Si, n+ a-Si layer (Back-channel-etched typeF5 mask)
@ Forming process of S/D electrode, n+ a-Si island (Back-channel-etched typeF5 mask)
@ Forming process of gate insulator film, Si channel, and S/D electrode (Back-channel-etched typeF4 mask)

CF (Color filter) forming process
Manufacturing process of CF for IPS mode/FFS mode TFT-LCD
Manufacturing process of CF for VA mode TFT-LCD
Manufacturing process of CF for TN/OCB mode TFT-LCD
Black matrix forming process
Manufacturing process of R, G, B color layer
Manufacturing process of overcoat layer
Deposition process of opposite electrode
Manufacturing process of post-spacer
Manufacturing process of rib (bump)
Photo-alignment process (for MVA mode TFT-LCD)

LC cell process
Polyimid coating process
Alignment process
Seal layer forming process
Dispersion process of spacer-ball
Making panel thinner process
Scribe and break process
Filling process of LC material
ODF (One drop fill) process

Module assemble process
Connect panel and driver-IC

Structure of backlight module
Side light type
@ Light guide plate technology
Structure of direct type
@ LED backlight for TV (Direct type, side light type)

3D technology
Method to use a specific glasses
@ LC shutter glasses method (Time sequential method)
@ Polarized glasses { patterned phase difference film (Space division method)

Specific glasses-free method
@ Parallax barrier method
@ Parallax barrier using dual emission OLED
@ Time sequential driving { parallax LC barrier method
@ Lenticular lens method
@ Time sequential twin-lens 3D-OCB method
@ Lenticular { time sequential scanning backlight method

Process flow of 4 PEP a-Si TFT

Structure of TAB and COF

Structure of BL module

3D technology sample

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PriceF21,000 yen
Release dateFJanuary 4th 2024

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CD-ROM lists of English virsion

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