Manufacturing process of CNT-TFT 2024 edition

Explain CNT-TFT manufacturing process by illustration
Full-cover from basic process to next generation process
Cover structure, substrate, material, and manufacturing process
Clearly difference of printable TFT and high quality TFT, which are main kinds of CNT-TFT
In the CNT semiconductor layer process, the detail processes from pre-treatment to CVD/wet coating process are explained

Easy to look at the file using any PC because of the format of browser, for example IE (Internet Explorer)
Possible to access at will from Index Page to detail page

Describe these illustrations at 3D image
Number of total file are 35 (about 80 page in A4 form equivalent)
Illustrations of device structure and process flow are approximately 190.


Structure of CNT-TFT
@ Bottom contact type
@ Top contact type
@ Flexible CNT-TFT
@ Transparent CNT-TFT

Manufacturing process of bottom contact CNT-TFT (General theory)
Manufacturing process of top contact CNT-TFT (General theory)

Forming process of gate electrode
@ In the case of using vacuum deposited film
@ In the case of using wet type material

Forming process of gate insulator film
@ In the case of use of organic material, wettable inorganic material
@ In the case of use of inorganic material
@ In the case of use of TaOx
@ In the case of use of AlOx{SAM

Forming process of S/D electrode
@ In the case of inorganic material (Dry-coating method)
@ In the case of wettable material
@ In the case of CNT

Forming process of transparent pixel electrode
@ In the case of transparent oxide material
@ In the case of metal material
@ In the case of wettable material (Conductive polymer, CNT, and Nano size Ag)

Forming process of CNT semiconductor layer
@ In the case of the CVD method
@ In the case of wet-coating method (SAM treatment, Separation and elimination of metallic SWCNT, Wet-coating method)

Co-forming process of S/D and CNT semiconductor layer by use of SAM

Forming process of passivation layer

A word of caution in manufacturing of CNT-TFT with flexible substrate
@ Case of using flexible substrate with film shape
@ CNT-TFT and device are manufactured on original substrate, and then transferred to plastic film
@ Resin is coated on support substrate and cured, and then, CNT-TFT and device are manufactured on resin film, finally, support substrate is released (the resin film is used as substrate)

Full-original CD-ROM

CD-ROM for Windows Macintosh
PriceF19,000 yen
Release dateFJanuary 4th 2024

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CD-ROM lists of English virsion

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Manufacturing process of FEL Manufacturing process of organic-TFT
Manufacturing process of CNT-TFT Manufacturing process of Perovskite solar cell

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